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About IC Pin Probes
IC pin probes are used to test integrated circuits (ICs). They differ in terms of contact type or pin type. Low profile pins are standard, low-height, printed circuit board (PCB) pins. Solder tail pins are designed to allow for easy soldering, and for other specialized applications. Wire wrap pins use a solderless wrap to achieve electrical connections. Typically, a stripped or unstripped wire is connected onto a wrap post. Straight pins terminate on both sides of the socket or receptacle. Spring loaded pins are telescopic, electromechanical interconnects. They typically consist of one or more contact members (plungers) and a helical coil spring housed within a conductive tube (barrel). Other contact types for IC pin probes are also available.
Center spacing, center pitch, plating materials, and approvals are important parameters to consider when selecting IC pin probes. Center spacing is measured in English units such as inches (in.) or fractions of an inch, or metric units such as millimeters (mm) or centimeters (cm). Center pitch is the center-to-center distance between two consecutive pins. Plating materials for IC pin probes include silver, copper, gold, and nickel. Gold-plated contacts are more expensive than silver-plated or copper contacts, and are offered generally as an upgraded connector. Non-plated products are also available. In terms of approvals, IC pin probes that are destined for sale in the Europe should comply with Restriction of Hazardous Substances (RoHS), a European Union (EU) directive.
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NetBSD/alpha: Multia Frequently Asked Questions but the cause of the typical Multia Heat Death is usually a bipolar TTL IC soldered to surface lands on the bottom side of the Multia system board. |
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High Performance Sockets and Adapters for prototyping,... SBT socket simplifies lab and evaluation applications due to low cost and better electrical/mechanical performance than conventional pogo pin. See Ironwood Electronics, Inc. Information |
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Non-Contact Test Access for Surface Mount Technology the large number of interconnects and soldering to Mount backdriving an IC's output lt might be necessary to force allow devices to be attached to See National Semiconductor Information |
