IC sockets and interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device.

Thin film materials are high purity materials and chemicals such as precursor gases, sputtering targets or evaporation filaments used to form or modify thin film deposits and substrates

Thin film sources consist of magnetrons, evaporation thermal units, ion beams and other sources that produce deposition materials (vapors or ions) in a thin film system.

Thin film circuits and products are metallized or plated onto ceramic substrates.

Thin film equipment uses vacuum processing for the modification of surfaces using CVD, PVD, plasma etching, and thermal oxidation or ion implantation.

Materials processing services providers manufacture mechanically or thermally process metals, ceramics, polymers, glasses or other materials on a contract basis.

Reactive and refractory metals include tungsten, molybdenum, niobium, tantalum, chromium, hafnium, zirconium, and titanium. Reactive metals oxide rapidly and form a stable oxide. Refractory metals and alloys have melting points above ~ 1750° C (~ 3200 F°).

Dielectric ceramics and substrates are electrical insulators with dielectric strength, dielectric constant and loss tangent values tailored for specific device applications.

Vacuum chambers and components are specialized vessels that can maintain a high vacuum process environment for manufacturing thin films, microelectronics, optics and materials. 

Vision calibration targets are precision test samples or patterns that are printed or etched on a substrate of glass or other material for dimensional calibration and depth-of-field determinations of machine vision systems, cameras or microscopes

Impedance matching networks are electrical circuits which, when connected between two networks, match the output impedance of the source (the first network) to the input impedance of the load (the receiving or second network). The purpose of matching these two impedances is to minimize wave reflection and/or to maximize the transfer of power between the system and the load.

Coating equipment is used to apply organic, inorganic or metal coatings onto part surfaces for industrial applications.

Thin film coating services apply very thin layers of specialized materials to part surfaces. They perform processes such chemical vapor deposition (CVD), physical vapor deposition (PVD), ion implantation, electrochemical deposition (ECD), plasma etching, rapid thermal processing (RTP), and titanium nitride coating.

Plasma power supplies are DC and RF devices used in plasma generation equipment for applications such as sputtering, plasma etching, physical vapor deposition (PVD) coating, and chemical vapor deposition (CVD) coating

Eddy current proximity sensors and switches detect the proximity or presence of a target by sensing the magnetic fields generated by a reference coil