The new low-profile HMCC interconnect system provides a low cost, micro-miniature option in RF transmission from board-to-board or board-to-panel. The pre-made jumpers use a Teflon coaxial cable and have machine-processed, low profile 90 degree snap-on connector to mate with a tape-and-reel, SMT receptacle jack. (read more)

Available in conductor sizes from microminiature up to 250 MCM, our ultra flexible interconnects are manufactured in a wide range of ropelay constructions in bare, tinned, silver or nickel plated copper and high-strength alloys. Most commonly supplied in UL and CSA recognized PVC insulated constructions, these items can also be insulated with silicone rubbers, polyurethanes or TPE's. (read more)

The PowerRail® – Pluggable Rail Power Distribution System offers: Continuous Power Over Full Rail - Ease of Installation - Cost Efficiency - High Power Density - Power ranges from 200A to 2000A - Cable or Bus Bar Interconnects and Eliminates Discrete Connectors (read more)

New compact designs in consumer electronics have increased the demand for smaller interconnect solutions. To meet this need, Molex Incorporated announced a new plastic optical fiber data link solution. Based on the Molex small media interconnect (SMI), this solution offers seamless, low cost optical data link solutions, as well as space saving qualities through its reduced size and added surfac... (read more)

W. L. Gore & Associates (Gore) and Quellan Incorporated launched a broad range of new GORE™ Extended Reach DDR Cable Assemblies. The new "active" cables deliver extended reach over thinner, lighter copper cabling for High-Performance Computing (HPC), Enterprise Server and Storage applications. (read more)

Gore introduces an on-line builder for configuring GORE™ Ultra High Density (UHD) Interconnects to use in Bench Top Test Systems, Instrument Probe Cable, Parallel Data Link, Production Floor Equipment, and Automated Test Equipment. (read more)

Polyfeed - Innovative flexible feeding solution Polyfeed is based on the use of a vision recognition system to recognize parts in their various forms and positions.

A patented vibration system isolates the parts for pre-orientation.

The Polyfeed is over 95% reusable; even if the customer makes changes to components there is no need to purchase a new feeding system (read more)

Mill-Max's BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm, .050" and .8mm grid footprints. (read more)

SMU-9000/9200 systems use proven inductive (eddy current) technology to measure position without contacting the target and are ideal for applications requiring high resolution. (read more)

As computer hardware and accessories evolve to meet ever-changing market demands for smaller sizes and rapid speeds, Molex Incorporated introduces its new ExpressCard™ header and ejector assembly. As a member of the Personal Computer Memory Card International Association (PCMCIA), Molex designed this interconnect system to be compatible with ExpressCard technology, a product that is prim... (read more)