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Product Categories for die attach
IC Sockets and Interconnect Components -
(474 companies)
IC sockets and interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device.
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Filler Alloys and Consumables -
(440 companies)
Filler metal alloys and consumables used in welding, brazing or soldering include items in rod sheet, wire spool, coated stick, weld stud, powder, preform or paste forms.
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Solder -
(164 companies)
Solders include low melting point metal alloys usually in wire, powder, preform or paste forms. Solders are metal alloys with low melting points that are used to join metals together.
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Electronic and IC Packaging Services -
(91 companies)
Integrated circuit packaging is the final stage of semiconductor device fabrication in which the bare die or bare boards are placed inside of a protective packaging that provides connectors or pins for connecting to other devices
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Die Sets -
(14 companies)
Die sets are assemblies that link the upper and lower die holders. They include guide pins or posts, guide pin bushings, heel blocks, heel plates, and die shoes
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Conductive Adhesives and Compounds -
(120 companies)
Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components.
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SMT Manufacturing Equipment -
(69 companies)
Surface mount technology (SMT) manufacturing equipment is used to populate printed circuit boards (PCB). This includes soldering machines, ovens, component placement, paste depositors and screen and stencils.
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Semiconductors and Semiconductor Materials -
(200 companies)
Semiconductors (metalloids) or semiconductor materials are used to fabricate microelectronic and optoelectronic devices such as transistors, photodetectors or solar cells.
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Thermal Compounds and Thermal Interface Materials -
(118 companies)
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
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Product and Component Testing Services -
(1378 companies)
Product and component testing services is the evaluation of a finished product or component through performance in electrical, life, environmental exposure, dynamic, ergonomic or other specialized tests. Also testing to standards such as UL 489, CE or MIL-STD 810.
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Adhesive Tapes and Films -
(690 companies)
Adhesive tapes and films temporarily or permanently join materials together.
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Shoulder Screws -
(30 companies)
Shoulder screws are fasteners with an unthreaded shank. The unthreaded shank is long when compared to its threaded portion, which is located under the head. Shoulder screws can be used to attach one machine part to another, or as a plain bearing in places where rotary or sliding motion is required
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Packaging Tapes and Films -
(664 companies)
Packaging tapes and films are used to seal or wrap boxes, bottles or other packages.
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Safety Sensors -
(322 companies)
Safety sensors are used for machine safeguarding. Types of safety sensors are break-a-beam switches, interlocks and tag out devices, perimeter guards, photoelectric safety sensors, safety blocks, safety interlock switches, and safety sensor switches.
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Die Cutting Services -
(567 companies)
Die cutting services use a variety of die cutting methods to fashion materials into predefined shapes or sizes
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Other Topics You Might Be Interested In
Thin plastic packages, such as TQFPs, are more sensitive to stress and warpage. As a result, warpage in TQFPs may lead to severe delamination or die cracking. The assembly process and the choice of...
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Traditionally, the most common types of die attach materials used in the semiconductor industry have been solder or adhesive. Both have been applied to the substrate, immediately before die attach.
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The dominant trend in packaging DDR DRAM for the future is the face down substrate-on-chip configuration. For this type of package it is critical that the die attach method employed provide precise...
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Thin plastic packages, such as TQFPs, are more sensitive to stress and warpage. As a result, warpage in TQFPs may lead to severe delamination or die cracking. The assembly process and the choice of...
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This procedure details the particular procedures required to safely handle GaAs Integrated Circuits in die form manufactured in M/A-COM’s P5 semiconductor foundry process. The M/A-COM P5 process does...
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