Heat sinks are thermally conductive, usually metallic components or devices that absorb and dissipate heat generated by electronic components such as computers. Common heat sink materials include aluminum, copper, and steel. Search by Specification | Learn More about Heat Sinks

CPU cards and modules are computer boards that contain the central processing unit (CPU) of a computer. Learn More about CPU Cards and Modules

CPU chips or central processing unit chips are used in digital computers and are the semiconductor component where most calculations take place. Learn More about CPU Chips

Microprocessor chips (MPU) are silicon devices that serve as the central processing unit (CPU) in computers. They contain thousands of electronic components and use a collection of machine instructions to perform mathematical operations and move Search by Specification | Learn More about Microprocessor Chips (MPU)

Advanced Telecommunications Computing Architecture (AdvancedTCA or ATCA) products use advanced telecom computing architecture (AdvancedTCA), an open standard for high-speed, high-performance telecommunications systems. Search by Specification | Learn More about AdvancedTCA Products

Heat exchangers are commonly used in a wide variety of industrial, chemical, and electronics processes to transfer energy and provide required heating or cooling. Search by Specification | Learn More about Heat Exchangers

They are essentially printed circuit boards (housing the computer’s basic circuitry and vital components), into which other boards, or cards, are plugged. They manage all transactions of data between the CPU (computer processing unit) and the peripherals... Search by Specification | Learn More about Computer Motherboards

...computers (SBC) serve as the motherboard for instrumentation systems including modern PCs. SBCs are composed of a microprocessor, memory chip, and serial and parallel interfaces to communicate with other devices. Processor or CPU type, processor... Search by Specification | Learn More about Single Board Computers (SBC)

Thermoelectric coolers are solid-state heat pumps used in applications where temperature stabilization, temperature cycling, or cooling below ambient levels are required. Learn More about Thermoelectric Coolers

Computational fluid dynamics software (CFD) is used for the calculation of flow parameters in fluids, and for the design and simulation of the behavior of fluidic systems. CFD is also used to simulate fluid mechanics. Learn More about Computational Fluid Dynamics Software (CFD)

IC sockets and headers are board-mounted female connectors that serve as carriers for integrated circuit (IC) chips. Search by Specification | Learn More about IC Sockets and Headers

IC sockets and interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device. Search by Specification | Learn More about IC Sockets and Interconnect Components

Heat transfer fluids, thermal oils, circulating coolants, and heater liquids are used to carry thermal energy in process heating and machine cooling applications. Search by Specification | Learn More about Heat Transfer Fluids and Thermal Oils

Resistive temperature device (RTD) elements are wire windings or other thin-film serpentines that exhibit changes in resistance with changes in temperature. They are usually made of metallic elements or alloys such as copper, nickel, or nickel-iron. Search by Specification | Learn More about Resistive Temperature Devices (RTD) Elements