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Keep current on the latest products, new suppliers, and technical articles of interest to you. (See Topics) |
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Flexible circuits use polyimide films and other foldable substrates to meet the requirements of complex electronic manufacturing applications
Learn MoreSemiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.
Search by Specification | Learn MoreThin film circuits and products are metallized or plated onto ceramic substrates
Learn MoreSensor chips are dies incorporating semiconductor circuit elements that are used to convert changes to some physical parameter to an electrical signal
Search by Specification | Learn MoreFlip-flops are digital logic devices that synchronize changes in output state (1 or 0) according to a clocked input.
Search by Specification | Learn MoreEncapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics
Search by Specification | Learn MoreIC phase-locked loops (PLL) are closed-loop frequency controls that are based on the phase difference between the input signal and the output signal of a controlled oscillator.
Learn MoreEnvironmental exposure (climatics) testing services use humidity, pressure, temperature, vibration, exposure to ultraviolet light (UV) and other climatic variables to test samples, parts and components, and finished products.
Search by Specification | Learn MoreElectronics assembly service companies based on providing contract design, manufacturing, and related product support services on behalf of electronics OEMs.
Search by Specification | Learn MoreIntegrated circuit packaging is the final stage of semiconductor device fabrication in which the bare die or bare boards are placed inside of a protective packaging that provides connectors or pins for connecting to other devices
Learn MorexDSL chips provide digital subscriber line (DSL) connectivity in a system-on-chip platform. The term xDSL refers collectively to all types of digital subscriber lines.
Learn MoreConformal coatings encapsulate circuit boards and their electronic components in order to prevent the ingress of moisture, fungus, dust and other environmental contaminants
Search by Specification | Learn MoreElectrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Search by Specification | Learn MoreSpecialized or proprietary products and accessories related to the manufacture of electronic or semiconductor components.
Learn MoreThermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
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Custom Flex Circuits Minco
Custom-Configured Waveguides Optical InterLinks
Copper Flex Circuits Molex
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Honeywell Introduces New Microelectronic Product Line For Military And Space Computer Systems
Sophisticated, Reliable Electronics Components Designed For Use in Military Applications, Space (read more)
Measurement products for load cells, strain gauges, pressure sensors, torque transducers, flow sensors, temperature sensors... the applications are numerous. We offer detailed application notes & technical info to help you identify the exact microelectronics needed to assist with your industrial measurement requirements. (read more)
The Sievers 500 RLe On-Line TOC Analyzer represents the latest advancement in the science of ultra low level TOC measurement in microelectronic applications. The 500 RLe is the industry's only on-line, reagentless TOC analyzer capable of accurately detecting problematic compounds such as urea, trimethylamine, organic acids and bases. (read more)
Prevent installation flaws and product failures. Get a flex circuit mechanical sample FREE! You can have confidence that your flex circuit will be the right size and shape and is properly constructed for its environmental interfaces. Kits contain comprehensive flex circuit training materials including a hard cover case that contains more than 25 flex circuit materials and finished circuits. (read more)
Now, the same company you trust for superior interconnects can handle all your copper flex needs––and deliver your solution in one neat package. Plus, Molex will work with you to customize your flex circuit to your specifications. We can build simple or highly complex copper flex solutions with up to 20 layers and beyond. Visit our website now to learn more. (read more)
Flex circuits offer OEM customers several options because they have trace routing, current carrying capabilities, and SMT component populating options of a FR4 printed circuit board; and flexibility of a membrane switch. Simple single layer copper flex on polyester or complex double-sided on polyimide, Memtron Input Components provides customers with application-specific solutions. (read more)
Precision High Density Multi-Layer Flex Circuits
Metrigraphics utilizes proprietary fabrication processes to produce precision ultra-high density multi-layer circuits with trace widths as low as 5 microns (0.0002") and aspect ratios up to 2:1. These circuits can be fabricated on a wide variety of flexible and rigid substrate material. (read more)
Methode has developed an innovative and reliable method to mass terminate wire, cable, flexible circuits or connectors directly to a printed circuit board without any solder, paste, or flux. Known as the Sonicrimp® Process, this mass termination technique is accomplished by aligning the conductors and circuit pads via a plastic cap and cradle and then compressing... (read more)
DRC Metrigraphics use a combination of process tools, high-resolution photolithography, thin-film coating, and micro-miniature 2-D and 3-D precision electroforming are combined to produce high density, multi-layer flexible circuits with 5-micron traces and spaces. (read more)
A new, mercury-free, PWB (printed wiring board) curing system that employs pulsed UV to cure multi-film flexible circuit boards without damage is being introduced by Xenon Corporation of Woburn, Massachusetts. (read more)
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| 425-1643-1-ND | Digi-Key | Sharp Microelectronics | Integrated Circuits (ICs) | IC REG LDO 2.5V 300MA SOT-23L |
| 425-1657-1-ND | Digi-Key | Sharp Microelectronics | Integrated Circuits (ICs) | IC REG LDO 2.5V 240MA SOT-23L |
| 425-1665-1-ND | Digi-Key | Sharp Microelectronics | Integrated Circuits (ICs) | IC REG LDO 5V 240MA SOT-23L |
| 425-1672-1-ND | Digi-Key | Sharp Microelectronics | Integrated Circuits (ICs) | IC REG LDO 2.8V 400MA SOT-23-5 |
| 425-2265-2-ND | Digi-Key | Sharp Microelectronics | Integrated Circuits (ICs) | IC REG LDO ADJ 1A ON/OFF SC-63 |
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AEROFLEX MICROELECTRONIC SOLUTIONS Circuit Card Assembly RF and Microwave AEROFLEX MICROELECTRONIC SOLUTIONS Welcome to Aeroflex Microelectronic Solutions Product Page. |
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United States Patent and Trademark Office Home Page lithographic imaging materials and techniques that have enabled the manufacturing of smaller, faster and more efficient microelectronic components. |
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DatasheetArchive - Free Datasheet Search Engine :: PDF... Co., Ltd. (623) Chip Express Corporation (943) Chloride Systems (4709) Circuit Interruption Technology, Inc. (1608) Cirrus Logic, Inc. (2851) CIT |
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Heinz Nixdorf Institute: Microelectronic Circuit Design Microelectronic Circuit Design Management of ULSI Design Processes and Products Ulrich Rückert > Teaching > Microelectronic Circuit Design |
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alt.comp.hardware.homebuilt FAQ Version 20 (modified 06/18/97) 2.12 How can I make my own circuit boards? |
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semiconductor-course This hypermedia course reviews the evolution of today's microelectronic integrated circuit (IC) chip technology, explains how IC's are made, and |
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What is MEMS Technology? While the electronics are fabricated using integrated circuit (IC) process sequences (e.g., CMOS, Bipolar, or BICMOS processes), the micromechanical |
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MOSFET - Wikipedia, the free encyclopedia 3 Circuit symbols 4 MOSFET operation 4.1 Metal?oxide?semiconductor structure |
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Voltage divider - Wikipedia, the free encyclopedia voltage divider (also known as a potential divider) is a simple linear circuit that produces an output voltage (Vout) that is a fraction of its input |
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International Rectifier - Application Notes Practical layout for Current Sensing Circuit of IRMCF300 Series IC PDF A New Circuit for Low-Cost Electronic Ballast PDF See International Rectifier Information |