Users can socket their 128 pin, 14mm, 0.4mm pitch Texas Instruments Power Pad QFP IC's without performance loss with smallest socket footprint (read more)

Users can interface to SMT pads for 0.8mm pitch, 32 pin QFP with RoHS compliant Package Emulator (read more)

Burn-In Testing Socket Type: PLCC, TSOP/SOP, QFP/TQFP, BGA/uBGA, QFN and etc.

Burn-In Testing Socket Brand: Yamaichi, Wells, Enplas, TI, Loranger, MCS

Pitch: 0.5mm ~ 1.27mm

Type: Open Top / Clam Shell

ROM Adapter: TSOP, QFP, BGA, etc. (read more)

Ironwood's GHz BGA & QFN/MLF sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.3mm. Standard sizes typically ship within 3 to 5 days ARO. (read more)

Mill-Max offers socket carriers for use with DC-DC converters. Rather than being soldered directly to the circuit board, DC-DC converters are often socketed to permit easy field replacement and repair. A socket carrier is a simple way to provide a low profile socket for a DC-DC converter. (read more)

Mill-Max's BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm, .050" and .8mm grid footprints. (read more)

Users can socket their 1mm pitch TI S-PBGA-N772 30X30 array BGA IC's without performance loss with smallest socket footprint (read more)

Users can socket their 1mm pitch ST Micro PBGA 23x23x2.06 288+36 pitch BGA IC's without performance loss with smallest socket footprint (read more)

Andon Electronics has developed the largest line of Image Sensor Sockets in the industry. We have sockets for Kodak, Hammamatsu, Sony, NEC, Marconi, Philips, Texas Instruments, Atmel, Toshiba, and all other image sensors. (read more)

Users can socket their 256 pin, 7mm, 0.4mm pitch Texas Instruments BGA IC's without performance loss with smallest socket footprint (read more)