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Product Alerts
Keep current on the latest products, new suppliers, and technical articles of interest to you. (See Topics) |
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IC sockets and interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device
Flip-flops are digital logic devices that synchronize changes in output state (1 or 0) according to a clocked input
Search by Specification | Learn MoreRF and wireless chips are integrated circuits (IC) that are designed specifically for radio frequency (RF), microwave, and other wireless communications or data transmission applications
Search by Specification | Learn MoreFLASH memory chips offer extremely fast access times, low power consumption, and relative immunity to severe shock or vibration. They do not need a constant power supply to retain their data. 
Search by Specification | Learn MoreDynamic random access memory (DRAM) chips are single-transistor memory cells that use small capacitors to store each bit of memory in an addressable format that consists of rows and columns. Because capacitors are unable to hold a charge indefinitely, DRAM memory chips require a near-constant pulse of current to retain stored information
Search by Specification | Learn MoreStatic random access memory (SRAM) chips do not need to be refreshed like DRAM chips. This makes SRAM chips faster and more reliable
Learn MoreField-programmable gate arrays (FPGAs) have a different architecture than SPLDs and CPLDs, and typically offer higher capacities. FPGAs are also known as logic cell arrays (LCA) and programmable ASIC (pASIC
Search by Specification | Learn MoreSupervisory circuits and battery monitor chips are semiconductor devices that detect and monitor voltage levels in power supplies, microprocessors, and other systems
Search by Specification | Learn MoreMicrocontrollers (MCU) are complete computer systems on a chip. They combine an arithmetic logic unit (ALU), memory, timer/counters, serial port, input/output (I/O) ports and a clock oscillator
Search by Specification | Learn MoreBattery charger ICs are integrated circuits (IC) that are used to charge batteries.
Search by Specification | Learn MoreDigital decoders and digital demultiplexers move data between inputs and outputs. In the case of digital decoders, the coded information is translated into familiar or uncoded formats, while digital multiplexers transmit data from one input through to several output lines.
Search by Specification | Learn MoreMonostable multivibrators, also known as one-shots, are digital devices similar to flip-flops, but with only one stable state where they remain until triggered by an input signal. Once triggered, the output is switched to the opposite state
Search by Specification | Learn MoreIC package converters and adapters are electronic interconnect devices that are used to interface different types of integrated circuit (IC) sockets.
Search by Specification | Learn MoreDigital counters are integrated circuits used for counting events in computers and other digital systems.
Search by Specification | Learn MoreDigital dividers are integrated circuits that divide the frequency of an input signal by a divisor value.
Search by Specification | Learn More|
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Procurement / Purchasing Services from Smith Smith & Associates
Flex Circuits Design Kit Minco
1.0mm Pitch BGA socket, 10 GHz bandwidth Ironwood Electronics, Inc.
0.4mm Pitch BGA Socket Ironwood Electronics, Inc.
BGA SMT Adapters Ironwood Electronics, Inc.
Tyco Electronics Medical- Safe Interconnet Systems Tyco Electronics Medical
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Custom multimode polymer waveguide TxRx arrays are created in self supporting films. Micromachining singulates array strips, creates I/O mirrors & coupling interfaces. Waveguides are separately optimized for Tx and Rx operation. After QC, waveguide strips with board edge connectors are precisely aligned & mounted on substrates. Components are flip chip bonded over the I/O mirrors. (read more)
Diode Arrays from American Microsemiconductor.
American Microsemiconductor Inc, designs low junction capacitance, fast switching and high reliability custom diode arrays in many diode array configurations and packages. (read more)
Diodes, Rectifiers, Diode Arrays, General Purpose Diodes, High-speed Diodes, Varistors and more from American Microsemiconductor, Inc. With over 17,000,000 electronic components sitting on our warehouse shelves we can almost guarantee that we've got the right part for the job! (read more)
BN300 Substrate for IC has high performance due to low warpage and high heat resistance due to high flexural modulus, low CTE and high Tg (300). (read more)
Users can socket their 1mm pitch ST Micro PBGA 23x23x2.06 288+36 pitch BGA IC's without performance loss with smallest socket footprint (read more)
With high resolution and fast switching speeds, the HLG augments the versatile array of existing light grid solutions from SICK. Ideal applications for the HLG include part counting and leading edge detection on a conveyor.
The HLG offers a higher resolution than the company's ELG Light Grids, resulting in a much smaller minimum detectable object (MDO) size of 2 mm. The HLG Light G...
(read more)
If 36 weeks delivery by our competitors is unacceptable Call AMS FOR 1N5719 mil spec pin diodes off the shelf and Immediate Delivery-No Wait. (read more)
Optimized for 1064 nm - Quadrant arrays and single active areas available. (read more)
Ironwood's GHz BGA & QFN/MLF sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.3mm. Standard sizes typically ship within 3 to 5 days ARO. (read more)
Perfectly cut laser edges just got easier with Epilog's new Vector Cutting Pin Table. (read more)
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Flip-chip pin grid array - Wikipedia, the free encyclopedia Flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array processor architecture package in which the die faces downwards on the top of |
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Pin grid array - Wikipedia, the free encyclopedia The plastic pin grid array (PPGA) and later flip-chip pin grid array (FCPGA) PPGA: Plastic pin grid array FCPGA: flip-chip pin grid array |
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Ball Grid Array (BGA) Packaging 14 14.1 Introduction packaging technology - the Flip Chip (FC)-style, H-PB- GA. The FC-style, H-PBGA component uses a Controlled Collapse Chip Connect die packaged in an See Intel Corporation Information |
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ROHS / Lead (Pb) Free Solutions Many Intel processors are in Pin Grid Array (PGA) packages. See Intel Corporation Information |
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FC-PGA: Flip Chip Pin Grid Array FC-PGA: Flip Chip Pin Grid Array Flip Chip Pin Grid Array (FC-PGA or FCPGA) FC-PGA: Flip Chip Pin Grid Array |
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Flip Chip Pin Grid Array definition - computer dictionary... Flip Chip Pin Grid Array <hardware, processor> (FC-PGA) The package of certain Intel Celeron and Pentium III processors. |
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Altera's RoHS-Compliant Devices has shipped over 80 million RoHS-compliant products since 2002, more than 12 million of which have been high pin-count ball-grid array (BGA) devices. See Altera Corporation Information |
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Programmable Logic Design Quick Start Handbook If a wire is drawn so that it Emphasis in text overlaps the pin of a symbol, the two nets are not connected. See Xilinx, Inc. Information |
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Xilinx DS312 Spartan-3E FPGA Family Data Sheet VQ(G)100 100-pin Very Thin Quad Flat Pack (VQFP) C Commercial (0?C to 85?C) XC3S250E ?5 High Performance CP(G)132 132-ball Chip-Scale Package (CSP) I See Xilinx, Inc. Information |
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