Ironwood's GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. They use innovative interconnect technology that delivers low signal loss (1dB at 6.5 GHz or 10GHz) and can support BGA or QFN/MLF pitches down to 0.3mm. Their sockets require far less PCB space than traditional mechanical-type sockets.

Ironwood's patent-pending designs utilize a unique, wire-filled elastomer to provide electrical connections to the BGA chip. The elastomer can be continuously used in applications with temperatures up to 85ºC, with intermittent peaks to 150ºC.

Spring Pin (Pogo) Sockets fit on the same footprint, operate to 150ºC, and have 500,000 insertion contacts.

Multiple gold plated wires embedded within the elastomer contact each solder ball of the IC device. No damage to IC solder balls after use. Each wire can easily carry typical IC power loads and results in a clean signal path approximately 1mm in length. Each socket is a precision device, guiding the IC to the exact position for connection and does not damage solder balls.

The basic GHz BGA sockets are mechanically mounted over a target system's BGA lands. These low-profile SMT sockets are only 2.5 mm per side larger than actual IC packages. Click for enlarged pic They support IC devices with body sizes ranging from 42.5mm down to 7mm. Larger body sizes may require a backing plate.

Alternative adapter bases are available that emulate the chip's BGA footprint and convert the socket into an SMT device when through hole mounting is not possible, at some decrease in performance. The SMT adapter bases are easily installed using standard flux and reflow techniques.

The GHz Land Sockets allow the GHz BGA ZIF Sockets to be mounted on an adapter and then the male pin assembly can be either inserted into PCB holes or mounted on a Giga-snaP female BGA SMT adapter.

Epoxy Mount - If through-holes are unacceptable, or if an even smaller footprint is required, an epoxy mounting option may be considered. While this creates a more or less permanent bonding of the socket to the PC Board the socket is designed such that the contacting elements are replaceable should damage or excessive wear occur. These patented ZIF sockets are simply mounted to the target PCB by an epoxy band around the perimeter. The socket is placed into position with a precision alignment tool and epoxied in place. A ring of epoxy around the socket strongly holds it in place. There are special grooves on the socket wall for additional epoxy strength. The contactor can be easily replaced after hundreds of cycles.

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