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Socket for 0.4mm Pitch QFN Packages

Socket for 0.4mm Pitch QFN Packages

Socket your Analog Devices QFN packages without significant performance loss and with minimal increase in PC Board footprint

BURNSVILLE, MN – May, 2007 – Ironwood Electronics has recently introduced the new high performance QFN socket for 0.4mm pitch devices. The SG-MLF-7019 sockets are designed for a 6mm package size, operate at bandwidths up to 10 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink. The contact resistance is typically 23 milliohms per pin. The socket connects all pins and the optional center power pad with 10+ GHz bandwidth on all connections. The SG-MLF-7019 is constructed with high performance and low inductance elastomer. The temperature range is -35 C to +85 C. The pin inductance is 10.15 nH. Capacitance to ground is 0.10 pF. The socket accommodates IC packages such as the AD6546. Simply attach the socket to the PCB, drop in chip, place lid. No tools required.

800-404-0204

info@ironwoodelectronics.com

www.ironwoodelectronics.com

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