Innovative technology in Ironwood's package and device converters minimizes cost and yet maximizes performance and reliability. For example, many of their converters for QFP devices incorporate our proprietary shaped solder technology, "SolderLink", Solder Link which provides a fast, highly reliable connection at a fraction of the cost of competing solutions. Multi-layer PC boards may incorporate controlled impedance features and eliminate external routings seen on some of their competitor's devices.

If one of their standard products does not meet your requirements, Ironwood Electronics is the industry leader in developing custom solutions. their custom engineering staff is the largest and most experienced in their industry. Quick turn design and manufacturing is a hallmark of their service to customers.

Device Conversion

When availability or performance of a given IC becomes an issue, an Ironwood device converter allows the use of a substitute device without requiring redesign of the target system. Package type, package code, even pin outs can be changed with an adaptor that fits in the original package space. Ironwood offers a number of standard device converter parts, however, device converters are typically developed to your unique specs.

"FIX" Adapters

Fix adapters solve design or layout problems, often by modifing pin out, package code characteristics and/or package type. They may incorporate corrective circuitry. These adapters are generally custom solutions, however, Ironwood offers some fix adapters as standard products in their catalog.

Package Converters

Package converters provide an electrical and mechanical conversion from one package type to another. Ironwood uses gold plated interconnects for our pin and through hole converters.

Ironwood offers products for each of the following package conversions. The part families are listed in "top interface to bottom interface" order.

• Miscellaneous Package Converters
  

  Many device specific package converters of all types have been lumped into this category.

• DIP to DIP
  

  These adapters change the width of your DIP package and use gold plated pins.

• DIP/SDIP to PLCC
  

  PLCC interfaces for DIP (or SDIP) packages. PLCC interface options: J-leaded surface mount foot (-J); PLCC plug (-P); and clip-on (-C). Some parts offer test points (-T).

• DIP/SDIP to QFP
  

  These two-part adapters consist of a leadless QFP foot (solders to the target board's surface mount land pattern) and a DIP or SDIP top that plugs into the foot. Some parts offer test points (-T).

• DIP to SOIC
  

  These adapters connect DIP packages to SOIC surface mount lands. We use a J-leaded foot that will interface with "J-lead" or gull wing land patterns. Parts are available in one-piece or two-piece (pluggable) versions.

• PGA to PLCC
  

  These adapters connect a PGA package to a PLCC interface. Two interface options for the bottom PLCC interface are available: a surface mounted J-Lead or a pluggable foot for use with production sockets.
  

  These converters can be combined with a PGA male to male socket to create a connection for an in-circuit emulator's female PGA head to a target board's PLCC footprint.

• PGA to PLCC (Device Specific)
  

  These converters are designed for specific IC devices.

• PGA to QFP
  

  These two piece adapters connect a PGA package to a QFP land pattern. The bottom QFP surface mount base part is available in gull-wing (-G) or low profile leadless (-L) versions. The top PGA part plugs to the base using gold plated connections.

• PLCC to PGA
  

  These adapters allow PLCC devices to be mounted on PGA through hole patterns. The PLCC device is soldered to the adapter's surface mount lands, giving the highest possible reliability. They also provide a reduced height compared to our converters with ZIF sockets (described below).

• PLCC to PGA (with ZIF sockets)
  

  These adapters allow PLCC devices to be mounted on PGA through hole patterns. The PLCC device is inserted into a high quality ZIF socket for easy device swaps.

• SOIC to DIP
  

  These adapters allow SOIC packages to be mounted on DIP through hole patterns. The SOIC device is soldered to the adapter's surface mount lands, giving the highest possible reliability. The adapter will accomodate J-leaded or gull wing SOIC devices.

• ZIP to DIP (misc)
  

  These adapters convert the staggered rows of a ZIP package to the more standard DIP male interface and use gold plated pins. Wire wrap pin versions (-W) are also available (please phone).

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info@ironwoodelectronics.com

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