Users can socket their 256 pin, 7mm, 0.4mm pitch Texas Instruments BGA IC's without performance loss with smallest socket footprint
BURNSVILLE, MN – Ironwood Electronics' new high performance socket – SG-BGA-7070 allows 0.4mm pitch, 7mm body, BGA IC's to be used in socket and operate without compromising performance in very high bandwidth applications. The new 10+ GHz bandwidth sockets (<-1dB at 10.0 GHz) support the very dense pitch BGA devices in a high density socket. The socket is designed to dissipate up several watts without extra heatsinking and can handle up to 100 watts with custom heatsink. The contact resistance is typically 23 milliohms per ball.
The SG-BGA-7070 is constructed with high performance and low inductance elastomer. The temperature range is -35 C to +85C. The pin inductance is 10.15 nH. Capacitance to ground is 0.10 pF. The socket accommodates IC packages such as the Texas Instruments TI ZXN (S-PBGA-N209) with 256 balls on 0.4 mm pitch.
800-404-0204
info@ironwoodelectronics.com
www.ironwoodelectronics.com
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