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BGA SMT Adapters

BGA SMT Adapters

Giga-snaP™ BGA SMT Adapters -

Reliable, Easy to plug, High Speed

The Giga-snaP™ 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for socketing 1mm BGA chips. The product line consists of patent pending female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board. The chip is interconnected, and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating.

Benefits

The patent pending over molding method for the adapter results in a much more reliable device. The coefficient of thermal expansion (CTE) of the BGA SMT foot adapter exactly matches that of the PCB to which it is attached, thus eliminating failures caused by CTE mismatch. Thermal changes from either component heat dissipitation or environmental effects will not result in fractured solder ball connections. Secondly, the Gig-snaP SMT adapters can be reflowed up to at least 3 times while maintaining full integrity of all solder ball connections. Adapters with pressed pins tend to fracture the substrate, which allows the solder ball to flow up the pin and wick away - sometimes on the initial solder attachment.

With ball counts in the 1000-2000 range large forces are normally required when inserting the male device. The force to mate conventional adapters may exceed 80 pounds (356 Newtons) for a 1000 pin device. The Giga-snaP™ BGA Surface Mount Feet Adapters require less than 1/3 the force, only resulting in about 26 pounds (115 Newtons) for the same device.

The electrical path of the Giga-snaP™ BGA SMT foot adapters is a high priority performance issue. The physical length from the point where the top connection point on the male adapter to the solder ball on the female is only 4.5 mm. This is the shortest connection length available in a machined pin and socket combination, thus providing better transmission of high frequency signals. Bandwidth for the Giga-snaP™ at -1 dB point is over 2 GHz and at -2 dB point over 5 GHz.

Ironwood Electronics has the tooling, software, and equipment in place to deliver quickly any array, custom or standard 0.75, 0.8, 1, and 1.27 mm Giga-snaP™. Their speed of delivery for BGA SMT adapters sets the pace for the industry.

800-404-0204

info@ironwoodelectronics.com

www.ironwoodelectronics.com

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Other Product Announcements from Ironwood Electronics, Inc.
Spring Pin Sockets, Package Converters, 0.4mm Pitch BGA Socket, Solder Column Adapters, Clam-Shell BGA Socket, 0.5mm Pitch, 10 GHz BGA Socket, 1.0mm Pitch BGA socket, 10 GHz bandwidth, 40 GHz Socket for 0.4mm Pitch QFN Packages, Socket for 0.4mm Pitch QFN Packages, Agilent Compatible Logic Analyzer Adapter, High Performance QFN Socket, BCC sockets, BGA Probing Adapter , QFN Probing Adapter, High Endurance Test Socket, QFP Socket, GHz BGA Socket , High Performance QFN Socket, Spring Pin Socket , SMT Package Emulation , 0.4mm pitch QFN Socket, Logic Analyzer Adapter, QFP Package Emulation, Prototyping Adapter
Other products from Ironwood Electronics, Inc. in IC Sockets and Interconnect Components
BGA (SMT Lands) Prototyping Adaptor -- PA-BGA-XC2S100-01, BGA (SMT Lands) Prototyping Adaptor -- PA-BGA100B-P-S-01, BGA (SMT Lands) Prototyping Adaptor -- PA-BGA100B-P-S-01W, BGA (SMT Lands) Prototyping Adaptor -- PA-BGA106A-C-S-01, BGA (SMT Lands) Prototyping Adaptor -- PA-BGA106A-C-S-01W, BGA (SMT Lands) Prototyping Adaptor -- PA-BGA110A-C-S-01, BGA (SMT Lands) Prototyping Adaptor -- PA-BGA110A-C-S-01W, BGA (SMT Lands) Prototyping Adaptor -- PA-BGA119A-C-S-01, BGA (SMT Lands) Prototyping Adaptor -- PA-BGA119A-C-S-01W, BGA (SMT Lands) Prototyping Adaptor -- PA-BGA128B-C-M-01


Supplier:
Ironwood Electronics, Inc.

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